Mitsubishi Gas Chemical to Expand Manufacturing, Product Inspection Facilities

Business Strategy Mitsubishi Gas Chemical to Expand Manufacturing, Product Inspection Facilities

2026-11-12 Source: Press release Mitsubishi Gas Chemical 2 min Reading Time

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With an aim to increase production capacity for BT materials used in semiconductor packaging, Mitsubishi Gas Chemical Company has decided to expand the manufacturing and product inspection facilities at MGC Electrotechno (Thailand) Co.

Mitsubishi Gas Chemical Company has recently announced its decision to expand the manufacturing and product inspection facilities at MGC Electrotechno (Thailand) Co., a subsidiary of MGC Electrotechno Co.(Source: Pixabay) — Mitsubishi Gas Chemical Company has recently announced its decision to expand the manufacturing and product inspection facilities at MGC Electrotechno (Thailand) Co., a subsidiary of MGC Electrotechno Co.
(Source: Pixabay)

Tokyo/Japan – Mitsubishi Gas Chemical Company has recently announced its decision to expand the manufacturing and product inspection facilities at MGC Electrotechno (Thailand) Co., a subsidiary of MGC Electrotechno Co., a BT materials manufacturer, in order to increase production capacity for BT materials used in semiconductor packaging.

The MGC Group established MGC-ETT in Thailand, in addition to MGC-ET in Japan, as part of its business continuity plan (BCP). Since 2013, MGC has built a global supply system for BT materials based on this two-site structure. To date, MGC-ET has served as the main plant, handling the mass production of new products as well as the production of cutting-edge, high-performance, and high-mix low-volume products. MGC-ETT has primarily handled the production of low-mix high-volume products. Furthermore, in 2025, the construction of an expansion plant at MGC-ETT was completed to strengthen production capabilities.

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With the overall expansion of the electronic materials market, the semiconductor and semiconductor packaging markets are also expected to continue growing, especially in the field of data center and server applications. The demand for FC-BGA substrates used in semiconductor packaging is also expected to increase. To further strengthen manufacturing and sales of BT materials for FC-BGA and drive the expansion of MGC’s business, new prepreg manufacturing equipment for copper clad laminates will be installed at MGC-ETT and shipping capacity will be increased by expanding the product inspection facilities.

Through this expansion of MGC-ETT’s facilities, the MGC Group will further strengthen its production capabilities for BT materials and its BCP capabilities. MGC is committed to responding swiftly to the diverse needs of the globally growing semiconductor market, while ensuring a stable supply of high-performance products.

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