Heat Exchangers ICAI organizes a Workshop on Microgroove Copper Tube Heat Exchangers
International Copper Association India (ICAI), a part of Copper Alliance, organized a special Workshop on Microgroove Copper Tube Heat Exchangers in Mumbai. The objective of the workshop was to showcase how smaller-diameter tubes can be used to increase the rate of heat transfer through coils in numerous applications, thereby improving the energy efficiency of appliances, including air conditioners.
Mumbai/India — This workshop was addressed by a panel of dignitaries comprising Sanjeev Ranjan, Managing Director, ICAI, Mayur Karmarkar, Director Asia – Sustainable Energy, ICAI, Cooper Zhao, Project, ICAI, Dr. Ren Tao, Industry Expert, Shanghai Jiao Tong University, Dr. R K Malhotra, Chairman, Spirotech Heat Exchangers and Mr. Liu Tao, Golden Dragon Group. The event was attended by various professionals in large numbers representing the research and development team of room air conditioners manufacturers and coil manufacturers from across India.
“Microgroove has a key role to play in the design of sustainable ACR products. It is now used to make refrigeration equipment, heat pumps and air conditioners that are more energy efficient. Such products could be powered more easily by sustainable energy sources. MicroGroove is one piece of the sustainability puzzle for cooling and refrigeration,” says Cooper Zhao, Project Manager, International Copper Association China. “In addition, it is suitable for use with many eco-friendly refrigerants.”
Use of 5mm Microgroove Copper condensers helps reduce cost, create higher energy efficiency, less refrigerant, comes with higher durability and demands low investments. Coils made with smaller diameter and inner grooved copper tubes enable efficiently removing heat from the refrigerant in case of the condenser coil or evaporator coil. This higher heat transfer efficiency increases the overall energy efficiency of the system. The use of smaller tubes also improves the air-flow outside the tubes because of the reduced form factor.”